MARKET NOTES / 001CHINA / SHANGHAI / ELECTRONIC COMPONENTS
LESS GUESSWORK. A BETTER RESEARCH LIST.

Electronic Components.
Shanghai.

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Who backs this market, where they enter, and how recently they have added a new company. A directory built around the questions founders actually ask.

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Companies are based in Shanghai · investors can be based anywhere
Dataset through 22 May 2026 · calculated 14 Sep 2026
01 / THE SHORTLIST LAB

Make the list work for your company.

1 backers based in Shanghai are shown by default. Compare up to three.

1 of 9 selected backers · Shanghai only

Shows investors whose recorded city is Shanghai. Unknown cities are excluded. Market charts cover all investor locations.

Theme filtering selects backers of companies carrying that theme tag. Entry-stage filtering selects backers with an entry at that stage; the two matches may be different companies. Row metrics describe their entire dated Electronic Components history in Shanghai.

Selected investors ranked by distinct companies backed, with first-entry financing and recent activity.
CompareInvestor / recorded locationCompanies
here
New in
24 months
Median total
entry round
Companies
backed again
Latest
investment
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THE INVESTOR, IN CONTEXT
LINKEDIN ACCESS

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02 / THE MARKET READ

Activity is a better starting point
than a long list of names.

Latest 24 months: after 22 May 2024 through 22 May 2026.

RECENT PARTICIPATION
8

Backers in a recent round

7 added at least one new company in this market. The remainder participated only in companies they had already backed here.

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MARKET PACE
2

Distinct equity rounds

Across 2 companies, versus 8 rounds in the preceding 24 months. Each company round is counted once.

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EARLY FINANCING
50%

Rounds at Angel, Pre-Seed or Seed

1 of 2 recent rounds. Compare your stage with its own financing range before sizing the ask.

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NEW RELATIONSHIPS
88%

Participations were first entries

7 first investor–company relationships out of 8 participations. The other 1 were later rounds together.

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Build a syndicate beyond the city.

Of 8 recently active backers, 0 have a recorded Shanghai location and 6 are based elsewhere. Location is missing for 2. Search by market experience first, then investigate the people and their remit.

Match the whole round to your plan.

Recent Seed rounds have a median size of $12M, across 1 disclosed amounts. That is total company financing. An individual investor’s cheque or available capital is not disclosed here.

04 / THE DEPTH MAP

One appearance, or a pattern?

39 of 40 backers with dated histories appear in just one company. Select a cell to explore the directory.

Backers by type and number of distinct Electronic Components companies backed in Shanghai, all dated history.
Portfolio breadth here1 company2 companies3–56–1011+
Firms & institutions
Individual angels

Circle area increases with backer count. The shortlist includes backers with 2 or more companies in this market, plus other backers active in the latest 24 months. In the 1-company cell, only recently active backers are available to explore. The shortlist’s investor-location filter also applies; select all locations to broaden the results. 0 backers have only undated entries.

05 / ROUND DESIGN

Different stages. Different capital.

Recent equity rounds · 24-month window.
Amounts are in USD.

StageDistinct roundsMedian / middle half
Seed
1
$12M$12M–$12M1 disclosed · small sample
Series C
1
$141M$141M–$141M1 disclosed · small sample
06 / FOLLOW THE EVIDENCE

The most recent recorded rounds.

Distinct company rounds.
Named backers are shown lead-first.

Seed

Developer of silicon-based passive devices, including capacitors, inductors, and resistors

$12M total equity round
3 named backers

Oriental Fortune Capital · Shique Investment · Zhen Fund

Series C

Developer & manufacturer of MOSFETs and gate drivers

$141M total equity round
5 named backers

China Capital Investment Group · China Developement Bank · Goldstone Investment · Haiwang Capital · SDIC

Series B

Provider of transmission and communication chip design and development solutions

$14M total equity round
4 named backers

China Fortune-innovation Capital · Hushan Capital · Qingyan Capital · Wofo Capital

Seed

Provider of power devices and intelligent sensors, offering various types of magnetic sensor chips, current sensor chips, and motor driver chips

Undisclosed total equity round
3 named backers

Chendao Capital · Hone Capital · Sanhuagroup

Series B

Developer & manufacturer of MOSFETs and gate drivers

Undisclosed total equity round
3 named backers

GF Xinde Investment Management · Lightspeed China Partners · Linxin Investment

Series A

Manufacturer of interconnection chips

$15M total equity round
3 named backers

Delta Capital · Hangzhou Guoxin Technology · Oceanpine Capital

07 / READING THE ATLAS

What these patterns can tell you.

The market boundary

Recorded equity rounds for companies tagged Electronic Components and located in Shanghai. Investor headquarters may be elsewhere. Company sector and location reflect the available company records, not necessarily the location or sector at the investment date.

The time boundary

Data coverage ends 22 May 2026. The latest market round is 16 Mar 2026. There are 0 undated participations, excluded from timing metrics. Activity after the cutoff is unknown.

The relationship boundary

“New” is the first dated relationship between a backer and a company in this market. “Backed again” requires a later dated round together. A first observed entry may follow an earlier unrecorded investment.

The financing boundary

Amounts describe entire equity rounds, not personal cheques, fund capacity or returns. Medians exclude missing and non-positive amounts; the middle half spans the 25th–75th percentiles. A recorded investment does not establish current availability.

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Calculated 14 Sep 2026 · 9 investor histories to explore