Industry landscapes
The companies, capital and talent shaping semiconductors in Bengaluru. Find the leaders. Understand the segments. See where the activity is.
An industry ecosystem,
measured in context.
24 featured companies from the funding, hiring, revenue and team-size leaderboards.
Locked revenue figures are available in Radar; the eight company financial previews stay the same throughout this page. A dash means the figure is outside these featured lists. Revenue years vary by company; the figures are not a like-for-like revenue comparison. Compare annual accounts ↗
Recently founded means a recorded 2023–2026 founding year and no recorded parent, acquirer or public-company status. These companies are not labelled startups without that separate classification.
Explore classified startups in Radar ↗A few useful ratios bring the size of this ecosystem into perspective.
79 of 481 tracked companies have open roles.
55 of 481 tracked companies have a recorded round.
Share of disclosed capital received by the three largest recorded recipients.
Midpoint of 100 rounds with a disclosed amount.
Scale is concentrated. Opportunity is broader. The three largest funding recipients hold 56.7% of disclosed capital, while 88.6% of tracked companies have no recorded funding round.
Explore the segments →Recorded company formation and disclosed funding across the complete annual series shown.
Sum of recorded funding rounds · USD
| Year | Funding (USD) | Founded | Raising |
|---|---|---|---|
| 2016 | $10.02M | 30 | 9 |
| 2017 | $22.12M | 30 | 10 |
| 2018 | $4.9M | 24 | 8 |
| 2019 | $7.32M | 24 | 5 |
| 2020 | $15.45M | 20 | 9 |
| 2021 | $41.89M | 28 | 6 |
| 2022 | $5.32M | 27 | 7 |
| 2023 | $5.44M | 35 | 5 |
| 2024 | $28.87M | 24 | 11 |
| 2025 | $215.36M | 5 | 10 |
Share of all disclosed company funding.
124 recorded rounds since 2016
Recorded participation in semiconductors company rounds since 2016.
Backed by Ideaspring Capital and Singularity AMC and others.
Backed by Indian Angel Network and Vertex Ventures and others.
Backed by Hero Enterprise Partner Ventures and Colossa Ventures and others.
Backed by EKK & Co.
Backed by Novo Tellus.
Backed by Florintree and Exim Bank and others.
Backed by Qualcomm Ventures and Edelweiss and others.
Backed by Peak XV Partners and Yali Capital and others.
Backed by Ideaspring Capital and Singularity AMC and others.
Backed by JAFCO Asia and Ventureast.
Backed by ST Asset Management and Qualcomm Ventures and others.
Backed by Nortel.
Backed by GM Ventures and Intel and others.
Backed by New Enterprise Associates.
Annual accounts for reporting companies linked to this landscape, on like-for-like currency and reporting bases.
Display conversions use the dated reference rates above. Where a verified rate is unavailable, figures retain their source currency. Each reporting cohort keeps its currency and accounting basis separate.
FY2025 · annual statements grouped by reported fiscal year; exact entity periods remain on preview rows · 173 reporting entities from 238 eligible matches.
Sum of reporting-entity revenue; not Bengaluru market sales.
Combined result for the same cohort.
Combined net income ÷ combined revenue.
The middle covered reporting entity.
101 of 173 covered entities.
Share of covered revenue from the five largest entities.
Reported cohort totals by year; coverage is stated for every period.
Bar height shows revenue. Changes in coverage can affect totals.
FY2025 · 173 reporting entities
Up to eight fixed company previews show financial amounts. Search and sort the wider company list, then continue in Radar.
| Company / reporting entity | Revenue | Net profit / loss | Net margin | Revenue growth | Total assets |
|---|---|---|---|---|---|
| Centum Electronics ↗L85110KA1993PLC013869 | ₹749.8 crore | ₹52.8 crore | +7.0% | — | ₹1,115.1 crore |
| Sasken ↗L72100KA1989PLC014226 | ₹445.8 crore | ₹48.8 crore | +10.9% | — | ₹917.4 crore |
| element14 ↗U30009KA2007PTC044448 | ₹413.1 crore | ₹32.0 crore | +7.7% | — | ₹197.1 crore |
| Mirafra Software Technologies ↗U72200KA2004PTC033822 | ₹348.8 crore | ₹5.1 crore | +1.5% | — | ₹109.4 crore |
| Trident Infosol ↗U72900DL2000PTC103737 | ₹205.3 crore | ₹17.4 crore | +8.5% | — | ₹112.9 crore |
| Hi-Q Electronics ↗U32104KA1983PTC005174 | ₹135.7 crore | ₹21.4 crore | +15.8% | — | ₹163.6 crore |
| Triphase Technologies ↗U31109KA1994PTC015367 | ₹85.5 crore | ₹4.2 crore | +4.9% | — | ₹87.5 crore |
| Advantech ↗U51109KA2012PTC064907 | ₹78.3 crore | ₹2.4 crore | +3.1% | — | ₹41.2 crore |
Explore full company accounts and filings.
Choose “View accounts” to inspect an available company preview.
Each pair uses the same year, currency and reporting basis. Cohort overlap is disclosed.
| Industry | Covered / eligible | Revenue total | Median revenue | Net profit / loss | Aggregate margin | Profitable share | Overlap |
|---|
Available-account cohorts are not estimates of whole industries. Overlapping entities can occur in more than one cohort; do not add cohort totals.
Filed annual accounts for exact designated national identifiers. Every aggregate and peer pair uses one fiscal year, source currency and reporting basis; periods, coverage and overlap are explicit; 2026 partials are excluded.
The same up to eight reporting entities remain open across years, filters and sorts. Other company figures are available in Radar.
Source currencies and accounting bases stay separate. Missing accounts are excluded rather than treated as zero. Exact reporting periods appear on company previews. Annual totals can change with coverage and do not measure growth of a fixed company cohort.
How the Bengaluru companies on this page show up online: the sites people visit, the apps they install, and how often those apps ship.
7 of these companies (1.5%) publish at least one Android app — 25 apps in all, carrying 86.9K installs between them.
| App | Installs | Rating | Store category |
|---|---|---|---|
| SensAiryTymtix | 72K | 2.5 | Auto & Vehicles |
| Advantech UID ManagerAdvantech | 6.6K | — | Tools |
| Livpure Smart ChimneyHoags | 2.3K | — | Lifestyle |
| iService InspectionAdvantech | 1.7K | — | Business |
| Super VoiceHoags | 1.2K | — | Lifestyle |
| iMobile ServicesAdvantech | 830 | — | Business |
| SBUS CAN AnalyzerSloki Software Technologies | 476 | — | Tools |
| HealthyPiProtocentral | 412 | — | Education |
| Wiser tDCSProtocentral | 150 | — | Communication |
| Advantech CCM MobileAdvantech | 134 | — | Business |
Installs are lifetime totals to date at the June 2026 store reading — a measure of reach, not of people using an app today.
The busiest app inside each of this page’s own segments, with the quarterly release trend behind it (2023Q2–2026Q1).
| Segment | Apps | Installs | Leading app | Release trend |
|---|---|---|---|---|
| Embedded Systems | 19 | 14.7K | Advantech UID Manager 6.6K | |
| Internet Of Things Infrastructure | 11 | 9.7K | iService Inspection 1.7K | |
| Semiconductor Design And Manufacturing Services | 4 | 141 | Smart Lock 90 |
A company can carry several segment tags, so these rows overlap and should not be added together. Trend lines are zero-based and share one quarter grid, so a flat line is a quiet segment, not a missing one.
New apps published, beside apps whose most recent update landed in that quarter — the second bar is how much of the shelf is still being maintained.
Darker bars are new releases, lighter bars apps updated. 23 of 25 apps carry a release date. The series ends at 2026Q1, the last quarter that closed before the June 2026 reading.
Explore the segments behind the headline numbers.
Rank segments by scale, hiring or disclosed funding.
Companies can sit in several segments. Counts and funding overlap.
The largest measured segment in this report snapshot.
19 companies hiring · $226.53M disclosed funding
Explore in RadarCommon revenue models; a company can use more than one.
Recorded corporate activity linked to companies in this landscape.
Semiconductor startup Morphing Machines raised $4.4 million to advance its reconfigurable processor technology, targeting high‑performance computing use cases.
SenseSemi raised roughly INR 25 crore to accelerate semiconductor design.
Entuple Technologies ’s $1.44 million raise from Varanium Capital Advisors Private Limited and Blue Ashva Capital may be modest in size, but it carries strategic significance.
However, only one company in this list, Centum Electronics, has doubled from its QIP issue price, with returns of 101% so far.
The share sale will be entirely an offer for sale, with up to 18.1 million equity shares being divested and no fresh equity being issued.
Virtusa Corporation today announced the acquisition of SmartSoC Solutions
onsemi has struck a deal to buy the Vcore power technology and related intellectual property from Aura Semiconductor
Bengaluru: Semiconductor start-up SandLogic is in early talks to raise $30-40 million in Series A funding at a valuation of $200 million, two people aware of the matter said.
Tessolve received $150 million in funding from TPG Growth
following which it plans to explore an IPO.
Top 10 categories among 156 recorded events in the 24-month window.
3 companies with recorded IPO activity
IPO · National Stock Exchange and the BSE2 reports
IPO1 reports
IPO1 reports
6 tracked people moves
Appointment President and Chief Operating Officer
Appointment Head of the Center for Applied Research in India (CARIn)
Appointment Vice President, Sales and Service
Appointment Head of Product Development, Vision Care Solutions
Appointment Chief Executive Officer of Mindteck (India) Limited
Appointment Chief Executive Officer
Products, platforms and features in the recorded window
Medical AI Board
Edge AI Board
6 recorded customer wins
Customer: CCRAFT SA, Alcyon Photonics SLPhotonics
Customer: Felix PlazaReal Estate
Customer: prostarm info systemsEnergy Storage
Customer: kp groupRenewable energy
Customer: enerpureRecycling
2 recorded events
visa affixed guaranteeing conformityAutorité des marchés financiers
approved for bonus issueBSE Ltd
Reported company results in the recorded window.
Median across 24 reported growth observations; companies may contribute multiple periods.
Company-linked deal reports; status is preserved as recorded.
| Acquirer → target | Status | Date | Value / context |
|---|---|---|---|
| tejas networks→Saankhya Labs ↗ | Announced | 2026-03-31 | Not stated in snapshot |
| Arvind Lakshmikumar, Ankit Kumar, Cecilia D’Souza→Tonbo Imaging ↗ | 2025-12-23 | Not stated in snapshot | |
| virtusa→SmartSoC ↗ | Announced | 2025-12-12 | Not stated in snapshot |
| infosys→Insemi ↗ | Announced | 2025-12-05 | Not stated in snapshot |
| onsemi→Aura Semiconductor ↗ | Completed | 2025-10-27 | Not stated in snapshot |
| on semiconductor→Aura Semiconductor ↗ | Announced | 2025-10-01 | Not stated in snapshot |
A discussion or rumour is not a completed transaction. An unstated value is not zero.
44 postings in the preceding 12 months. The full 53-posting snapshot covers 39 employers.
0 tracked postings mention remote work.
27 postings specify a level.
Top skills across 53 tracked postings in the available jobs snapshot.
| Company | Employees |
|---|---|
| Advantech ↗ | 8,379 |
| Mirafra Software Technologies ↗ | 1,620 |
| Centum Electronics ↗ | 1,448 |
| Sasken ↗ | 1,443 |
| Delta ↗ | 831 |
| Mindteck ↗ | 730 |
| Caliber Interconnect Solutions ↗ | 375 |
| Eltel Industries ↗ | 375 |
363 founders and chief executives across 232 companies.
Co-Founder & CEO-Tessolve · Ex-Centillium Communications, Cirrus Logic · BIT Mesra BE, University of Southern California MSc 1992
Ex-Serial Innovations india, Sarnoff, Samsung Research India, Infosys · Kuvempu University BE 2001
Sasken Technologies, ex-Quest Global, ex-Barclays, National Institute of Technology Karnataka, 1986
Centum Electronics, ex-Akka Technologies, ex-Assystem, Business school, 1995
Ex- The Resource, Texas Instruments. Sri Jayachamarajendra College of Engg BSEE, Rutgers Graduate School of Education MSEE
Ex-NexGen Power Systems, Western Digital, SanDisk · B. M. S. College of Engineering BE 1987, University of Idaho MS 1992
Morphing Machines, ex-Youngovator, ex-Scool Life, Stanford University, 2006
Sandlogic, ex-Online Psb Loans, ex-Proarch, Sri Venkateswara University, 2000
Ex-Intel, Asarva Chips And Technologies · Bapuji Institute of Engineering and Technology (BIET), Davanegere BE 1994…
Ex-AMD, Intel. NIT Karnataka BE 1998, Purdue University MS 2000
Ex- Ittiam Systems, Texas Instruments. Bangalore University BE, IIT Madras MS
Ex-Cadence Design Systems, Silicon & Beyond, ON Semiconductor, Texas Instruments. IIT Varanasi BTech 2001, IISc MSc 2008
56 profiles with education records.
27 profiles with prior-work records.
Profiles cover recorded founders and leaders; contact details remain in Radar.
4,216 articles in the measured 12-month window.
Semiconductors coverage tagged Bengaluru · articles per complete quarter
| Quarter | Articles |
|---|---|
| 2021Q2 | 382 |
| 2021Q3 | 447 |
| 2021Q4 | 458 |
| 2022Q1 | 454 |
| 2022Q2 | 541 |
| 2022Q3 | 635 |
| 2022Q4 | 806 |
| 2023Q1 | 790 |
| 2023Q2 | 848 |
| 2023Q3 | 962 |
| 2023Q4 | 925 |
| 2024Q1 | 914 |
| 2024Q2 | 1,063 |
| 2024Q3 | 1,304 |
| 2024Q4 | 1,218 |
| 2025Q1 | 1,422 |
| 2025Q2 | 846 |
| 2025Q3 | 1,167 |
| 2025Q4 | 1,085 |
| 2026Q1 | 1,057 |
Article volume measures coverage, not market sales.
212 recorded company events across 23 companies; percentages use that event total.
Semiconductors coverage tagged Bengaluru · ranked by full-period article count.
Recent and prior counts use the source comparison windows.
India comparison coverage
| Keyword | Recent | Prior | Change |
|---|---|---|---|
| cheap notebook | 765 | 17 | 4400% |
| budget laptop | 764 | 14 | 5357% |
| affordable laptop | 764 | 14 | 5357% |
| value laptop | 762 | 16 | 4662% |
| starter laptop | 758 | 10 | 7480% |
| basic laptop | 749 | 14 | 5250% |
| entry-level notebook | 733 | 15 | 4787% |
| tariff negotiations | 375 | 228 | 64% |
| android tablet | 329 | 214 | 54% |
| ai research | 328 | 229 | 43% |
| pre-ipo valuation | 89 | 159 | -44% |
| electromagnetic compatibility tester | 3 | 151 | -98% |
| emc test equipment | 2 | 150 | -99% |
| fitness tracker | 94 | 150 | -37% |
| financial report | 95 | 143 | -34% |
India comparison coverage
stock performance, flagship pricing, smartwatch
49.2% critical · 51.7% positivepre-ipo valuation, ipo prospectus, ipo pricing
51.9% critical · 57.6% positivesemiconductor chips, semiconductor wafers, semiconductor components
37.6% critical · 62.8% positiveSemiconductors coverage tagged Bengaluru. Topic labels describe recorded classifications and can include broad context.
1,671 papers in the recorded india scope.
Tone counts: 1,548 positive · 96 neutral · 27 negative.
Landmark: Adhesion–delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices
Landmark: Carbon Nanotube Based 3-D Interconnects - A Reality or a Distant Dream
Landmark: Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
Common problems researchers identify · 0132.6% of this theme group
Researchers highlight low‑power design and signal interference issues in large‑scale integrated circuits.
Very-large-scale integration (11) · Integrated circuit (13) · Interconnection (5) · Electronic engineering (7)
A Review on low-Power VLSI CMOS and CNTFET Circuits
Reduction of Electrical Signal Interference for future IC Integration-An Extensive Review
| Year | Share index |
|---|---|
| 2022 | 2594.7 |
| 2023 | 2628.7 |
| 2024 | 1944.1 |
| 2025 | 1163.0 |
Common problems researchers identify · 0229.1% of this theme group
Papers discuss the risk of malicious modifications in programmable and ASIC designs and related reliability concerns.
Hardware Trojan (4) · Electronic circuit (6) · Integrated circuit (7) · Trojan (2)
A Review on HT Attacks in PLD and ASIC Designs with Potential Defence Solutions
Device Reliability to Circuit Qualification: Insights and Challenges
| Year | Share index |
|---|---|
| 2022 | 968.8 |
| 2023 | 983.3 |
| 2024 | 758.9 |
| 2025 | 829.1 |
Common problems researchers identify · 0323.3% of this theme group
Studies point out vulnerabilities in electronic design automation tools and testing methods for mixed‑signal circuits.
Automation (3) · Mixed-signal integrated circuit (3) · Electronic design automation (3) · SIGNAL (2)
Towards Secure Composition of Integrated Circuits and Electronic Systems: On the Role of EDA
Testing of Analog Circuits using Statistical and Machine Learning Techniques
| Year | Share index |
|---|---|
| 2022 | 62.9 |
| 2023 | 60.2 |
| 2024 | 47.5 |
| 2025 | 77.4 |
Common problems researchers identify · 0415.1% of this theme group
Works examine material and device constraints of emerging nanostructured power transistors.
Nanotechnology (4) · Power semiconductor device (3) · Transistor (6) · Electronics (5)
P‐Type 2D Semiconductors for Future Electronics
Review and Evaluation of Power Devices and Semiconductor Materials Based on Si, SiC, and Ga‐N
| Year | Share index |
|---|---|
| 2022 | 3804.3 |
| 2023 | 3790.0 |
| 2024 | 3350.5 |
| 2025 | 2405.5 |
Cautions · 0137.5% of this theme group
Authors caution about interface traps, threshold shifts, and their impact on device and circuit stability.
CMOS (4) · Transistor (3) · Threshold voltage (2) · MOSFET (2)
Impact of Interface Traps on Negative Capacitance Transistor: Device and Circuit Reliability
CMOS terahertz receivers
| Year | Share index |
|---|---|
| 2022 | 2430.4 |
| 2023 | 2440.8 |
| 2024 | 2231.1 |
| 2025 | 2138.9 |
Cautions · 0221.9% of this theme group
Research warns of aging, stress, and radiation impacts on advanced tunnelling and 3‑D IC structures.
Quantum tunnelling (2) · Semiconductor (2)
A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors
TCAD simulation study of heavy ion radiation effects on hetero junctionless tunnel field effect transistor
| Year | Share index |
|---|---|
| 2022 | 474.3 |
| 2023 | 474.5 |
| 2024 | 358.7 |
| 2025 | 395.5 |
Cautions · 0321.9% of this theme group
Papers highlight heat‑induced failures and electromigration concerns in dense interconnects.
Electromigration (2) · Electronic circuit (3) · Very-large-scale integration (2) · Interconnection (2)
Cross-coupled Self-Heating and Consequent Reliability Issues in GaN-Si Hetero-integration: Thermal Keep-Out-Zone Quantified
Limitations of integrating field induced aggregation based fault repair automatons with integrated circuits
| Year | Share index |
|---|---|
| 2022 | 1003.3 |
| 2023 | 1008.1 |
| 2024 | 779.5 |
| 2025 | 866.2 |
Cautions · 0418.8% of this theme group
Studies note manufacturing and material challenges for three‑dimensional interconnects and photonic components.
Three-dimensional integrated circuit (3) · Fabrication (2) · Integrated circuit (2)
Carbon Nanotube Based 3-D Interconnects - A Reality or a Distant Dream
Integrated photonic materials for the mid‐infrared
| Year | Share index |
|---|---|
| 2022 | 2404.3 |
| 2023 | 2314.7 |
| 2024 | 2105.0 |
| 2025 | 2457.7 |
Opportunities · 0123.6% of this theme group
Investigations explore novel transistor concepts and carbon‑nanotube devices for next‑generation circuits.
Semiconductor (71) · Transistor (71) · Semiconductor device (28) · Carbon nanotube field-effect transistor (15)
An atom-to-circuit modeling approach to all-2D metal–insulator–semiconductor field-effect transistors
Thermal analysis of onboard front-end AC/DC converter for EV using advanced semiconductor devices
| Year | Share index |
|---|---|
| 2022 | 1772.2 |
| 2023 | 1783.1 |
| 2024 | 1549.3 |
| 2025 | 1518.1 |
Opportunities · 0221.7% of this theme group
Works present efficient logic, memory, and layout techniques to reduce power consumption in CMOS chips.
CMOS (176) · Static random-access memory (27) · Transistor (48) · Electronic circuit (56)
Design and Simulation of Reliable Low Power CMOS Logic Gates
Area efficient layout design of CMOS circuit for high-density ICs
| Year | Share index |
|---|---|
| 2022 | 2442.5 |
| 2023 | 2452.8 |
| 2024 | 2237.5 |
| 2025 | 2141.2 |
Opportunities · 0313.3% of this theme group
Research proposes optimized floorplanning and ASIC designs for neural networks and ultra‑low‑power embedded systems.
Very-large-scale integration (87) · Floorplan (16) · Application-specific integrated circuit (18) · Routing (15)
VLSI Architecuture for Neural Network Based Image Compression
Sub-Threshold VLSI Circuits for Energy-Efficient Embedded Systems
| Year | Share index |
|---|---|
| 2022 | 94.1 |
| 2023 | 90.0 |
| 2024 | 53.6 |
| 2025 | 84.4 |
Opportunities · 0412.5% of this theme group
Papers introduce testing, simulation, and design methods to detect and prevent hardware trojan attacks.
Hardware Trojan (20) · Trojan (14) · Integrated circuit (33) · Hardware security module (11)
Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill
New Methods for Simulation Speed-up and Test Qualification with Analog Fault Simulation
| Year | Share index |
|---|---|
| 2022 | 17.3 |
| 2023 | 18.8 |
| 2024 | 8.2 |
| 2025 | 11.5 |
Opportunities · 0512.4% of this theme group
Studies focus on combining photonics with electronics to achieve high‑performance, low‑power integrated solutions.
Photonic integrated circuit (19) · Integrated circuit (46) · Photonics (22) · Electronic circuit (48)
Innovative Techniques in the Construction of Very Large Scale Integration Circuits for Low-Power and High-Performance Circuits
Application Specific Digital and Mixed-Signal Integrated Circuit Designs Based on Algorithm Hardware Co-Design
| Year | Share index |
|---|---|
| 2022 | 2328.3 |
| 2023 | 2440.4 |
| 2024 | 2089.2 |
| 2025 | 2531.6 |
Opportunities · 068.2% of this theme group
Research develops optimization strategies for through‑silicon vias and placement to manage heat in stacked chips.
Three-dimensional integrated circuit (62) · Through-silicon via (22) · Integrated circuit (27) · Interconnection (16)
Minimizing Thermal Disparities during Placement in 3D ICs
Multi-objective Optimization of Placement and Assignment of TSVs in 3D ICs
| Year | Share index |
|---|---|
| 2022 | 330.1 |
| 2023 | 311.9 |
| 2024 | 220.4 |
| 2025 | 324.5 |
Opportunities · 078.2% of this theme group
Works propose low‑power scan chain wrappers and compression methods to improve test security and speed.
Scan chain (68) · Automatic test pattern generation (32) · Test compression (21) · Design for testing (18)
A generic low power scan chain wrapper for designs using scan compression
An efficient test technique to prevent scan-based side-channel attacks
| Year | Share index |
|---|---|
| 2022 | 21.4 |
| 2023 | 15.9 |
| 2024 | 8.8 |
| 2025 | 5.8 |
Orientation shares compared with 25,000 papers in the reference sample.
| Research orientation | This field | Reference sample |
|---|---|---|
| Promising | 44.9% | 37.1% |
| Breakthrough | 29.9% | 26.1% |
| Descriptive | 10.3% | 17.3% |
| Comparative | 7.7% | 3.7% |
| Problem-identifying | 5.0% | 10.1% |
| Cautionary | 2.0% | 4.6% |
| Critical | 0.2% | 1.1% |
Counts and shares refer to the stated research pool. A low count describes how much of that research is recorded here, not the absence of a real-world concern.
| Concern / example paper | Papers | Share | Raised as a problem | Worldwide share |
|---|---|---|---|---|
| Energy & datacenter footprintLarge-Scale Integrated Photonic Device Platform for Energy-Efficient AI/ML Accelerators | 4 | 0.25% | 0 (0.0%) | 0.12% |
| Hardware, e-waste & supply chainOn-chip RO-Sensor for Recycled IC Detection | 2 | 0.13% | 0 (0.0%) | 0.05% |
| Water useNumerical Investigation of Embedded Micro Pin-Fin Two-Phase Liquid Cooling for Dual-Chip Stacks in HPC and AI Systems | 1 | 0.06% | 0 (0.0%) | 0.08% |
| Privacy & surveillanceChairman's message | 1 | 0.06% | 0 (0.0%) | 0.02% |
| Carbon & emissions of compute | 0 | 0.0% | 0 (%) | 0.0% |
| Labour & data work | 0 | 0.0% | 0 (%) | 0.0% |
| Safety & misuse | 0 | 0.0% | 0 (%) | 0.01% |
| Bias & fairness | 0 | 0.0% | 0 (%) | 0.02% |
| Concentration of compute power | 0 | 0.0% | 0 (%) | 0.01% |
Institution and researcher rankings use citations to their covered work. Research scope: India. This may be broader than the company geography.
Clear definitions for making better comparisons.
It measures the tracked company ecosystem, recorded funding, hiring and other available evidence. It is not a market-size estimate.
No. A company can belong to several segments, so segment counts and funding can overlap.
A dash or unavailable panel means the current reviewed source snapshot does not support that figure.
Company ecosystem snapshot: 2 September 2026. Funding is recorded in USD; filed accounts retain their stated currency and reporting basis. Each section identifies its own coverage. The news and research behind these sections is explorable in Prism.
Canonical landscape ↗