50,441papers
50,441worldwide comparison pool
—India-affiliated papers
Research orientation
Contribution mix
Tone counts: 44,747 positive · 5,010 neutral · 684 negative.
Common problems researchers identify
3,155 papers · 6.3% of this field
- Integrated circuit669 papers
- Electronic circuit482 papers
- Reliability374 papers
- Electronics352 papers
- Semiconductor351 papers
- CMOS321 papers
- Transistor317 papers
- Interconnection230 papers
Landmark: A Survey of Hardware Trojan Taxonomy and Detection
Cautions
1,576 papers · 3.1% of this field
- Electronic circuit193 papers
- Reliability185 papers
- Transistor180 papers
- CMOS158 papers
- Integrated circuit153 papers
- Semiconductor146 papers
- Interconnection130 papers
- Optoelectronics98 papers
Landmark: Lithography and Other Patterning Techniques for Future Electronics
Opportunities
36,379 papers · 72.1% of this field
- Electronic circuit4,996 papers
- Integrated circuit4,462 papers
- CMOS4,401 papers
- Semiconductor3,397 papers
- Transistor3,148 papers
- Chip1,983 papers
- Optoelectronics1,931 papers
- Photonics1,832 papers
Landmark: A Survey of Wide Bandgap Power Semiconductor Devices
Leading institutions
Georgia Institute of Technology
10,552 University of California, Santa Barbara
7,464 University of Illinois Urbana-Champaign
7,051 École Polytechnique Fédérale de Lausanne
6,491 Leading researchers
Mohammad Tehranipoor
2,895 Highly cited breakthrough-labelled papers
- An integrated semiconductor device enabling non-optical genome sequencing2,150 citations
- Stretchable and Foldable Silicon Integrated Circuits1,653 citations
- Integrated Circuits and Logic Operations Based on Single-Layer MoS<sub>2</sub>1,321 citations
- A Physically Transient Form of Silicon Electronics1,249 citations
- Highly stretchable polymer semiconductor films through the nanoconfinement effect1,194 citations
Common problems researchers identify
2,978 papers · 7 recurring themes
Common problems researchers identify · 01Integrated Circuit / Electronic Circuit
639 papers21.5% of this theme group
Integrated circuit (327) · Electronic circuit (231) · Mixed-signal integrated circuit (75) · Electronic engineering (89)
Design and test of analog circuits towards sub-ppm level
Design of CMOS RF Integrated Circuits and Systems
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Common problems researchers identify · 02Transistor / Cmos
513 papers17.2% of this theme group
Transistor (214) · CMOS (189) · Electronic circuit (118) · Nanoelectronics (36)
Nanoelectronic Materials, Devices and Modeling: Current Research Trends
1Meeting the Design Challenges of nano-CMOS Electronics
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Common problems researchers identify · 03Reliability / Hardware Security Module
506 papers17.0% of this theme group
Reliability (150) · Hardware security module (37) · Reliability engineering (58) · Hardware Trojan (25)
Reliability- and Process-variation aware design of integrated circuits — A broader perspective
Device Reliability to Circuit Qualification: Insights and Challenges
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Common problems researchers identify · 04Semiconductor / Semiconductor Device
496 papers16.7% of this theme group
Semiconductor (268) · Semiconductor device (123) · Power semiconductor device (82) · Silicon carbide (44)
Power-Semiconductor Devices and Components for New Power Converter Developments: A key enabler for ultrahigh efficiency power electronics
Research and Progress on Organic Semiconductor Power Devices
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Common problems researchers identify · 05Integrated Circuit Packaging / Wafer
471 papers15.8% of this theme group
Integrated circuit packaging (74) · Wafer (92) · Soldering (53) · Interconnection (96)
Advancing Electronic Packaging Using Microsolder Balls: Making 25-nm Pitch Interconnection Possible
Moldability Challenges Associated with the Assembly of Thicker IC Packages for High Voltage and Power Applications
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Common problems researchers identify · 06Three-Dimensional Integrated Circuit / Integrated Circuit
200 papers6.7% of this theme group
Three-dimensional integrated circuit (93) · Integrated circuit (91) · Stacking (28) · Through-silicon via (24)
Test Challenges for 3D Integrated Circuits
3D integration: Circuit design, test, and reliability challenges
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Common problems researchers identify · 07Photonics / Photonic Integrated Circuit
153 papers5.1% of this theme group
Photonics (113) · Photonic integrated circuit (72) · Silicon photonics (34) · Integrated circuit (66)
Photonic Integrated Circuits for Optical Communication
Silicon Photonics Technologies for Monolithic Electronic-Photonic Integrated Circuit Applications
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Cautions
1,478 papers · 7 recurring themes
Cautions · 01Semiconductor / Transistor
304 papers20.6% of this theme group
Semiconductor (102) · Transistor (79) · Semiconductor device (36) · Power semiconductor device (32)
Fine-Tuning the\nPerformance of Ultraflexible Organic\nComplementary Circuits on a Single Substrate via a Nanoscale Interfacial\nPhotochemic
MECHANISM OF BIJUNCTION SEMICONDUCTOR DEVICE DAMAGE INDUCED BY HEAVY PARTICLES
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Cautions · 02Electronic Circuit / Integrated Circuit
283 papers19.1% of this theme group
Electronic circuit (93) · Integrated circuit (84) · Very-large-scale integration (19) · Reliability engineering (17)
Securing Analog Mixed-Signal Integrated Circuits Through Shared Dependencies
Electromigration Failures in Integrated Circuits: A Review of Physics-Based Models and Analytical Methods
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Cautions · 03Cmos / Transistor
252 papers17.1% of this theme group
CMOS (113) · Transistor (63) · Static random-access memory (24) · Scaling (25)
Analog circuit reliability in sub-32 nanometer CMOS: Analysis and mitigation
Stralingstolerante en Verouderingsresistente Digitale Geïntegreerde Schakelingen in Nanoscale CMOS Technologie.
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Cautions · 04Ball Grid Array / Integrated Circuit Packaging
214 papers14.5% of this theme group
Ball grid array (43) · Integrated circuit packaging (51) · Soldering (52) · Lead frame (27)
Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-$k$ Interconnects in Flip-Chip Packages
Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die
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Cautions · 05Photonics / Photonic Integrated Circuit
204 papers13.8% of this theme group
Photonics (31) · Photonic integrated circuit (17) · Silicon photonics (13) · Wafer (25)
A Review of Integrated Photonic Devices Using Sb<sub>2</sub>Se<sub>3</sub>
Experimental evaluation of photonic integrated circuits for multilayer photonic neural networks
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Cautions · 06Through-Silicon Via / Three-Dimensional Integrated Circuit
149 papers10.1% of this theme group
Through-silicon via (59) · Three-dimensional integrated circuit (58) · Stacking (21) · Interconnection (40)
Analysis of coupling capacitance between TSVs and metal interconnects in 3D-ICs
Thermal analysis of three-dimensional ICs, investigating the effect of through-silicon vias and fabrication parameters
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Cautions · 07Schottky Diode / Diode
72 papers4.9% of this theme group
Schottky diode (31) · Diode (37) · Schottky barrier (18) · Optoelectronics (33)
Defect engineering in SiC technology for high-voltage power devices
The behavioral approach to silicon carbide power components modeling
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Opportunities
33,846 papers · 7 recurring themes
Opportunities · 01Semiconductor / Semiconductor Device
1,186 papers19.8% of this theme group
Semiconductor (493) · Semiconductor device (143) · Transistor (224) · Heterojunction (72)
A Meeting of Materials: Integrating Diverse Semiconductor Technologies for Improved Performance at Lower Cost
Semiconductor transformers
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Opportunities · 02Cmos / Amplifier
1,168 papers19.5% of this theme group
CMOS (520) · Amplifier (137) · Electrical engineering (121) · Transistor (174)
Integration of Complementary Metal–Oxide–Semiconductor 1-Bit Analog Selectors and Single-Electron Transistors Operating at Room Temperature
Design techniques for low power mixed analog-digital circuits with application to smart wireless systems.
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Opportunities · 03Electronic Circuit / Integrated Circuit
1,035 papers17.2% of this theme group
Electronic circuit (463) · Integrated circuit (360) · Electronic engineering (164) · Mixed-signal integrated circuit (77)
Timing Verification for Adaptive Integrated Circuits
On-chip Structures and Techniques to Improve the Security, Trustworthiness and Reliability of Integrated Circuits
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Opportunities · 04Scan Chain / Standard Cell
956 papers15.9% of this theme group
Scan chain (94) · Standard cell (104) · Field-programmable gate array (76) · Automatic test pattern generation (47)
Standard Cell Layout Generator Amenable to Design Technology Co-Optimization in Advanced Process Nodes
FPGA Simulations of Charge Sharing Effect Compensation Algorithms for Implementation in Deep Sub-Micron Technologies
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Opportunities · 05Wafer / Integrated Circuit Packaging
738 papers12.3% of this theme group
Wafer (151) · Integrated circuit packaging (79) · Interconnection (110) · Soldering (62)
A high throughput and reliable thermal compression bonding process for advanced interconnections
Advanced Multifunctional Temporary Bonding Materials with Heterogeneous Integrated Properties for Various Advanced Packaging Applications
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Opportunities · 06Photonics / Photonic Integrated Circuit
503 papers8.4% of this theme group
Photonics (282) · Photonic integrated circuit (202) · Silicon photonics (63) · Optoelectronics (110)
Hybrid Silicon Photonic Integrated Circuit Technology
Silicon photonic devices and integrated circuits
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Opportunities · 07Three-Dimensional Integrated Circuit / Through-Silicon Via
414 papers6.9% of this theme group
Three-dimensional integrated circuit (166) · Through-silicon via (104) · Stacking (51) · Integrated circuit (111)
Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications
Design and manufacturing enablement for three-dimensional (3D) integrated circuits (ICs)
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How this field compares with the research baseline
Orientation shares compared with 25,000 papers in the reference sample.
Concerns receiving less research attention
Counts and shares refer to the stated research pool. A low count describes how much of that research is recorded here, not the absence of a real-world concern.
Institution and researcher rankings use citations to their covered work. Research scope: worldwide. This may be broader than the company geography.