the United States’s
semiconductors industry,
in focus.

Semiconductor / Power Semiconductor Device

20.8% of this theme group

Semiconductor (49) · Power semiconductor device (24) · Silicon carbide (20) · Semiconductor device (26)

Power-Semiconductor Devices and Components for New Power Converter Developments: A key enabler for ultrahigh efficiency power electronics

Potential Design for Electron Transmission in Semiconductor Devices

Reliability / Hardware Security Module

19.0% of this theme group

Reliability (42) · Hardware security module (14) · Intellectual property (10) · Reliability engineering (19)

Reliability- and Process-variation aware design of integrated circuits — A broader perspective

Robust and resilient designs from the bottom-up: Technology, CAD, circuit, and system issues

Mixed-Signal Integrated Circuit / Integrated Circuit

18.5% of this theme group

Mixed-signal integrated circuit (28) · Integrated circuit (46) · Electronic circuit (36) · Analogue electronics (10)

Design and test of analog circuits towards sub-ppm level

Cases for Analog Mixed Signal Computing Integrated Circuits for Deep Neural Networks

Integrated Circuit Packaging / Flip Chip

14.4% of this theme group

Integrated circuit packaging (22) · Flip chip (17) · Soldering (17) · Wafer (23)

Thermo-Mechanical Challenges in Stacked Packaging

Enabling Die-to-Wafer Hybrid Bonding for the Next Generation Advanced 3D Packaging

Three-Dimensional Integrated Circuit / Integrated Circuit

12.4% of this theme group

Three-dimensional integrated circuit (37) · Integrated circuit (36) · Stacking (15) · Through-silicon via (11)

Test Challenges for 3D Integrated Circuits

3D integration: Circuit design, test, and reliability challenges

Electrostatic Discharge / Electromigration

9.5% of this theme group

Electrostatic discharge (17) · Electromigration (10) · Reliability (27) · Reliability engineering (18)

ESD Protection Designs: Topical Overview and Perspective

Circuit reliability

Photonics / Photonic Integrated Circuit

5.4% of this theme group

Photonics (34) · Photonic integrated circuit (21) · Silicon photonics (11) · Optoelectronics (9)

Scalable 3D Silicon Photonic Electronic Integrated Circuits and Their Applications

Design Technology for Scalable and Robust Photonic Integrated Circuits: Invited Paper

Electronic Circuit / Reliability

27.7% of this theme group

Electronic circuit (26) · Reliability (22) · Integrated circuit (19) · Interconnection (20)

A model for electric degradation of interconnect low-k dielectrics in microelectronic integrated circuits

Design and testing of high-speed interconnects for superconducting multi-chip modules

Cmos / Transistor

20.6% of this theme group

CMOS (18) · Transistor (19) · Static random-access memory (8) · Scaling (7)

CMOS-Integrated Optical Receivers for On-Chip Interconnects

Insight on the Characterization of MoS₂Based Devices and Requirements for Logic Device Integration

Through-Silicon Via / Three-Dimensional Integrated Circuit

11.7% of this theme group

Through-silicon via (28) · Three-dimensional integrated circuit (17) · Wafer (9) · Silicon (7)

Performanace and reliability analysis of 3D-integration structures employing Through Silicon Via (TSV)

Thermal characterization of TSV based 3D stacked ICs

Flip Chip / Ball Grid Array

11.7% of this theme group

Flip chip (15) · Ball grid array (9) · Soldering (11) · Integrated circuit packaging (9)

Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-$k$ Interconnects in Flip-Chip Packages

Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging

Silicon Carbide / Schottky Diode

11.4% of this theme group

Silicon carbide (10) · Schottky diode (7) · Diode (8) · Optoelectronics (11)

Review—Radiation Damage in Wide and Ultra-Wide Bandgap Semiconductors

Thermal Performance and Reliability Analysis of a Medium-Voltage Three-Phase Inverter Considering the Influence of High $dv/dt$ on Parasitic

Three-Dimensional Integrated Circuit / Integrated Circuit

10.8% of this theme group

Three-dimensional integrated circuit (14) · Integrated circuit (15) · Stacking (6) · Hardware security module (4)

Thermal Evaluation of 2.5-D Integration Using Bridge-Chip Technology: Challenges and Opportunities

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC

Lead Frame / Quad Flat No-Leads Package

6.2% of this theme group

Lead frame (7) · Quad Flat No-leads package (6) · Wire bonding (6) · Miniaturization (3)

Effect of Thermal Cycling on Reliability of QFN Packages

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Semiconductor / Optoelectronics

24.4% of this theme group

Semiconductor (354) · Optoelectronics (289) · Transistor (252) · Semiconductor device (110)

High-Performance WSe₂Complementary Metal Oxide Semiconductor Technology and Integrated Circuits

A Meeting of Materials: Integrating Diverse Semiconductor Technologies for Improved Performance at Lower Cost

Electronic Circuit / Integrated Circuit

19.0% of this theme group

Electronic circuit (413) · Integrated circuit (445) · Electronic engineering (232) · Mixed-signal integrated circuit (100)

Systematic Design of Analog CMOS Circuits

Enabling the integrated circuits of the future

Standard Cell / Routing

14.5% of this theme group

Standard cell (174) · Routing (70) · Very-large-scale integration (71) · Static random-access memory (47)

On process-aware 1-D standard cell design

Machine Learning Prediction for Design and System Technology Co-Optimization Sensitivity Analysis

Three-Dimensional Integrated Circuit / Through-Silicon Via

13.1% of this theme group

Three-dimensional integrated circuit (377) · Through-silicon via (154) · Stacking (90) · Integrated circuit (216)

Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration

TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs

Soldering / Integrated Circuit Packaging

12.1% of this theme group

Soldering (138) · Integrated circuit packaging (138) · Flip chip (131) · Interconnection (215)

Wire Bonding Advances for Multi-Chip and System in Package Devices

Advanced Multifunctional Temporary Bonding Materials with Heterogeneous Integrated Properties for Various Advanced Packaging Applications

Scan Chain / Hardware Trojan

9.1% of this theme group

Scan chain (144) · Hardware Trojan (83) · Automatic test pattern generation (89) · Trojan (55)

Secure Scan and Test Using Obfuscation Throughout Supply Chain

SS-KTC: A High-Testability Low-Overhead Scan Architecture with Multi-level Security Integration

Photonics / Photonic Integrated Circuit

7.7% of this theme group

Photonics (299) · Photonic integrated circuit (233) · Silicon photonics (82) · Optoelectronics (134)

Hybrid Silicon Photonic Integrated Circuit Technology

Silicon photonics integrated circuits: a manufacturing platform for high density, low power optical I/O’s

San Jose

25.5% across the displayed hubs

35 companies hiring · $10.7B disclosed funding

Santa Clara

17.2% across the displayed hubs

25 companies hiring · $9.3B disclosed funding

Austin

12.6% across the displayed hubs

14 companies hiring · $2.6B disclosed funding

San Diego

10.6% across the displayed hubs

13 companies hiring · $1.7B disclosed funding

San Francisco

9.8% across the displayed hubs

16 companies hiring · $2.4B disclosed funding

Sunnyvale

9.7% across the displayed hubs

15 companies hiring · $8.9B disclosed funding

Fremont

7.9% across the displayed hubs

7 companies hiring · $3.1B disclosed funding

Irvine

6.7% across the displayed hubs

14 companies hiring · $678.9M disclosed funding